-工业用Engraving, Grinding, Drilling (Glass, AL, SUS, Ceramic, Silicon, Acryl , Dental 等) 离心分离器、超高速、超精密Actuator

- 半导体用Dicing Saw( Silicon Wafer、Ceramic、Glass、QFN、PCB等难切削的材料)

- PCB用Micro Drilling 等